Process Advantages
Publish Time: 2025-07-22
Changshan Precision Laser Cutting focuses on the field of high-precision micro-machining. With a machining accuracy of ±0.01mm, it can stably achieve precision structural processing of micro-holes of 0.02mm, slits of 0.015mm, and hole spacing of 0.05mm. Through the combination of "laser cutting + non-contact polishing" processes, cutting burrs can be effectively eliminated to meet the strict requirements of the medical and semiconductor industries for surface quality. For 0.01-3.0mm metal materials, we use dynamic energy control technology to significantly reduce the heat-affected zone and reduce product processing thermal deformation.
This capability has been maturely applied to the large-scale production of key components such as medical (such as precision sieve plates), precision electronics (such as camera module brackets), semiconductor carriers, and new energy coating gaskets, and the processing consistency can be verified through third-party test reports.
